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MTSF3N02HD
Preferred Device
Power MOSFET 3 Amps, 20 Volts
N-Channel Micro8t
These Power MOSFET devices are capable of withstanding high energy in the avalanche and commutation modes and the drain-to-source diode has a very low reverse recovery time. Micro8 devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc-dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. * Miniature Micro8 Surface Mount Package - Saves Board Space * Extremely Low Profile (<1.1mm) for thin applications such as PCMCIA cards * Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life * Logic Level Gate Drive - Can Be Driven by Logic ICs * Diode Is Characterized for Use In Bridge Circuits * Diode Exhibits High Speed, With Soft Recovery * IDSS Specified at Elevated Temperature * Avalanche Energy Specified * Mounting Information for Micro8 Package Provided
8
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3 AMPERES 20 VOLTS RDS(on) = 40 mW
N-Channel D
G S
MARKING DIAGRAM
Micro8 CASE 846A STYLE 1 1
WW AC
WW
= Date Code
PIN ASSIGNMENT
Source Source Source Gate 1 2 3 4 8 7 6 5 Drain Drain Drain Drain
Top View
ORDERING INFORMATION
Device MTSF3N02HDR2 Package Micro8 Shipping 4000 Tape & Reel
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2000
1
November, 2000 - Rev. 5
Publication Order Number: MTSF3N02HD/D
MTSF3N02HD
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Drain-to-Source Voltage Drain-to-Gate Voltage (RGS = 1.0 M) Gate-to-Source Voltage - Continuous 1 SQ. FR-4 or G-10 PCB Figure 1 below Thermal Resistance - Junction to Ambient Total Power Dissipation @ TA = 25C Linear Derating Factor Drain Current - Continuous @ TA = 25C Continuous @ TA = 70C Pulsed Drain Current (Note 1.) Thermal Resistance - Junction to Ambient Total Power Dissipation @ TA = 25C Linear Derating Factor Drain Current - Continuous @ TA = 25C Continuous @ TA = 70C Pulsed Drain Current (Note 1.) Symbol VDSS VDGR VGS RTHJA PD ID ID IDM RTHJA PD ID ID IDM TJ, Tstg Max 20 20 8.0 70 1.79 14.29 6.1 4.9 49 160 0.78 6.25 4.0 3.2 32 - 55 to 150 Unit V V V C/W Watts mW/C A A A C/W Watts mW/C A A A C
Steady State Minimum FR-4 or G-10 PCB Figure 2 below
Steady State
Operating and Storage Temperature Range 1. Repetitive rating; pulse width limited by maximum junction temperature.
Figure 1. 1, Square FR-4 or G-10 PCB
Figure 2. Minimum FR-4 or G-10 PCB
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MTSF3N02HD
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 Adc) Temperature Coefficient (Positive) (Cpk 2.0) (Notes 2. & 4.) V(BR)DSS 20 - IDSS - - IGSS - - - - 1.0 25 100 nAdc - 16 - - Vdc mV/C Adc Symbol Min Typ Max Unit
Zero Gate Voltage Drain Current (VDS = 16 Vdc, VGS = 0 Vdc) (VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C) Gate-Body Leakage Current (VGS = 8.0 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (Note 2.) Gate Threshold Voltage (Cpk 2.0) (VDS = VGS, ID = 250 Adc) Threshold Temperature Coefficient (Negative) Static Drain-to-Source On-Resistance (VGS = 4.5 Vdc, ID = 3.8 Adc) (VGS = 2.7 Vdc, ID = 1.9 Adc) (Cpk 2.0) (Note 4.)
VGS(th) 0.7 - 0.98 2.65 30 40 7.5 1.1 - 40 50 -
Vdc mV/C m - -
(Note 4.)
RDS(on)
Forward Transconductance (VDS = 10 Vdc, ID = 1.9 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS (Note 3.) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge
(Note 2.)
gFS
4.0
Mhos
Ciss (VDS = 15 Vd VGS = 0 Vdc, Vdc, Vd f = 1.0 MHz) Coss Crss
- - -
475 255 110
- - -
pF
td(on) (VDS = 10 Vdc, ID = 3.8 Adc, VGS = 4.5 Vdc, RG = 6 ) (Note 2.) tr td(off) tf td(on) (VDD = 10 Vdc, ID = 1.9 Adc, VGS = 2.7 Vdc, RG = 6 ) (Note 2.) tr td(off) tf QT (VDS = 16 Vdc, ID = 3.8 Adc, VGS = 4.5 Vdc) Q1 Q2 Q3
- - - - - - - - - - - -
9.5 45 50 62 19 130 38 47 12 1.0 5.0 3.5
- - - - - - - - 17 - - -
ns
ns
nC
SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage (IS = 3.8 Adc, VGS = 0 Vdc) (Note 2.) (IS = 3.8 Adc, VGS = 0 Vdc, TJ = 125C) (IS = 3.8 Adc, VGS = 0 Vdc, 3 8 Ad Vd dIS/dt = 100 A/s) (Note 2.) Reverse Recovery Storage Charge 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 3. Switching characteristics are independent of operating junction temperature. 4. Reflects typical values. Max limit - Typ Cpk = 3 x SIGMA VSD - - trr ta tb QRR - - - - 0.83 0.68 46 23 23 0.05 1.0 - - - - - C ns Vdc
Reverse Recovery Time
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MTSF3N02HD
TYPICAL ELECTRICAL CHARACTERISTICS
8 I D , DRAIN CURRENT (AMPS) 7 6 5 4 3 2 1 0 0 0.4 0.8 1.2 1.6 2 1.5 V 8 I D , DRAIN CURRENT (AMPS) 7 6 5 4 3 2 1 0 1 1.2 1.4 TJ = -55C 25C 100C 1.6 1.8 2 VDS 10 V
VGS = 10 V 4.5 V 2.9 V 2.5 V 2.3 V 2.1 V
TJ = 25C 1.9 V
1.7 V
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
Figure 3. On-Region Characteristics
RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) 0.06 0.05 0.04 0.03 0.02 0.01 RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) 0.06 0.05 0.04 0.03 0.02 0.01
Figure 4. Transfer Characteristics
VGS = 3.8 V TJ = 25C
TJ = 25C
VGS = 2.7 V 4.5 V
0
2 4 6 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
8
0
1
2
3
4
5
6
7
8
ID, DRAIN CURRENT (AMPS)
Figure 5. On-Resistance versus Gate-to-Source Voltage
RDS(on), DRAIN-TO-SOURCE RESISTANCE (NORMALIZED)
Figure 6. On-Resistance versus Drain Current and Gate Voltage
2.0
VGS = 4.5 V ID = 1.9 A
1000
VGS = 0 V
TJ = 125C 100C
1.0
I DSS , LEAKAGE (nA)
1.5
100
10
0.5
1
25C
0 -50
-25
0
25
50
75
100
125
150
0.1
0
4
8
12
16
20
TJ, JUNCTION TEMPERATURE (C)
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 7. On-Resistance Variation with Temperature
Figure 8. Drain-to-Source Leakage Current versus Voltage
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MTSF3N02HD
POWER MOSFET SWITCHING Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (t) are determined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculating rise and fall because drain-gate capacitance varies greatly with applied voltage. Accordingly, gate charge data is used. In most cases, a satisfactory estimate of average input current (IG(AV)) can be made from a rudimentary analysis of the drive circuit so that t = Q/IG(AV) During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as the plateau voltage, VSGP. Therefore, rise and fall times may be approximated by the following: tr = Q2 x RG/(VGG - VGSP) tf = Q2 x RG/VGSP where VGG = the gate drive voltage, which varies from zero to VGG RG = the gate drive resistance and Q2 and VGSP are read from the gate charge curve. During the turn-on and turn-off delay times, gate current is not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an RC network. The equations are: td(on) = RG Ciss In [VGG/(VGG - VGSP)] td(off) = RG Ciss In (VGG/VGSP)
2500 2000 C, CAPACITANCE (pF) 1500 1000 500 0 Crss 4 VDS Ciss Coss 8 4 VGS 0 8 12 16 20 Ciss Crss
The capacitance (Ciss) is read from the capacitance curve at a voltage corresponding to the off-state condition when calculating td(on) and is read at a voltage corresponding to the on-state when calculating td(off). At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. The resistive switching time variation versus gate resistance (Figure 11) shows how typical switching performance is affected by the parasitic circuit elements. If the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. The circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. Most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. Power MOSFETs may be safely operated into an inductive load; however, snubbing reduces switching losses.
TJ = 25C VGS = 0 V
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 9. Capacitance Variation
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MTSF3N02HD
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 6 5 4 3 2 1 Q3 0 0 3 6 9 Qg, TOTAL GATE CHARGE (nC) 12 ID = 3.8 A TJ = 25C Q1 VDS Q2 QT VGS 18 15 12 9 6 3 0 15 1000 VDD = 10 V ID = 3.8 A VGS = 4.5 V TJ = 25C tf tr
100 t, TIME (ns)
td(off) 10 td(on)
1
1
10 RG, GATE RESISTANCE (OHMS)
100
Figure 10. Gate-To-Source and Drain-To-Source Voltage versus Total Charge
Figure 11. Resistive Switching Time Variation versus Gate Resistance
DRAIN-TO-SOURCE DIODE CHARACTERISTICS The switching characteristics of a MOSFET body diode are very important in systems using it as a freewheeling or commutating diode. Of particular interest are the reverse recovery characteristics which play a major role in determining switching losses, radiated noise, EMI and RFI. System switching losses are largely due to the nature of the body diode itself. The body diode is a minority carrier device, therefore it has a finite reverse recovery time, trr, due to the storage of minority carrier charge, QRR, as shown in the typical reverse recovery wave form of Figure 14. It is this stored charge that, when cleared from the diode, passes through a potential and defines an energy loss. Obviously, repeatedly forcing the diode through reverse recovery further increases switching losses. Therefore, one would like a diode with short trr and low QRR specifications to minimize these losses. The abruptness of diode reverse recovery effects the amount of radiated noise, voltage spikes, and current ringing. The mechanisms at work are finite irremovable circuit parasitic inductances and capacitances acted upon by
4 VGS = 0 V TJ = 25C
high di/dts. The diode's negative di/dt during ta is directly controlled by the device clearing the stored charge. However, the positive di/dt during tb is an uncontrollable diode characteristic and is usually the culprit that induces current ringing. Therefore, when comparing diodes, the ratio of tb/ta serves as a good indicator of recovery abruptness and thus gives a comparative estimate of probable noise generated. A ratio of 1 is considered ideal and values less than 0.5 are considered snappy. Compared to ON Semiconductor standard cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter trr), have less stored charge and a softer reverse recovery characteristic. The softness advantage of the high cell density diode means they can be forced through reverse recovery at a higher di/dt than a standard cell MOSFET diode without increasing the current ringing or the noise generated. In addition, power dissipation incurred from switching the diode will be less due to the shorter recovery time and lower switching losses.
I S , SOURCE CURRENT (AMPS)
3
2
1
0 0.4
0.5
0.6
0.7
0.8
0.9
VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 12. Diode Forward Voltage versus Current
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MTSF3N02HD
di/dt = 300 A/s I S , SOURCE CURRENT Standard Cell Density trr High Cell Density trr tb ta
t, TIME
Figure 13. Reverse Recovery Time (trr)
SAFE OPERATING AREA The Forward Biased Safe Operating Area curves define the maximum simultaneous drain-to-source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, "Transient Thermal Resistance - General Data and Its Use."
100 I D , DRAIN CURRENT (AMPS) VGS = 8 V SINGLE PULSE TC = 25C 10 ms
Switching between the off-state and the on-state may traverse any load line provided neither rated peak current (I DM ) nor rated voltage (V DSS ) is exceeded, and that the transition time (t r, tf ) does not exceed 10 s. In addition the total power averaged over a complete switching cycle must not exceed (T J(MAX) - T C )/(RJC ).
10
1 ms
100 s
1 dc 0.1
0.01 0.1
RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 1 10 100 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 14. Maximum Rated Forward Biased Safe Operating Area
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MTSF3N02HD
TYPICAL ELECTRICAL CHARACTERISTICS
1000 Rthja(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE ( C/W) D = 0.5 0.2 0.1 0.05 0.02 0.01 1.0 SINGLE PULSE 1.0E-04 1.0E-03 1.0E-02 1.0E-01 t, TIME (s) t2 DUTY CYCLE, D = t1/t2 1.0E+00 t1
100
10
P(pk)
RJC(t) = r(t) RJC D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RJC(t) 1.0E+01 1.0E+02 1.0E+03
0.1 1.0E-05
Figure 15. Thermal Response
di/dt IS trr ta tp IS tb TIME 0.25 IS
Figure 16. Diode Reverse Recovery Waveform
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MTSF3N02HD INFORMATION FOR USING THE Micro8 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process.
0.041 1.04
0.208 5.28
0.126 3.20
0.015 0.38
0.0256 0.65
inches mm
Micro8 POWER DISSIPATION The power dissipation of the Micro8 is a function of the input pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the Micro8 package, PD can be calculated as follows:
PD = TJ(max) - TA RJA
into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 0.78 Watts.
PD = 150C - 25C = 0.78 Watts 160C/W
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values
The 160C/W for the Micro8 package assumes the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 0.78 Watts using the footprint shown. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Cladt. Using board material such as Thermal Clad, the power dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
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MTSF3N02HD
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 14 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 "RAMP" 200C
STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP"
STEP 4 HEATING ZONES 3 & 6 "SOAK"
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
160C
STEP 5 STEP 6 STEP 7 HEATING VENT COOLING ZONES 4 & 7 205 TO 219C "SPIKE" PEAK AT 170C SOLDER JOINT
150C 100C 100C DESIRED CURVE FOR LOW MASS ASSEMBLIES 5C 140C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 17. Typical Solder Heating Profile
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MTSF3N02HD
TAPE & REEL INFORMATION
Micro8 Dimensions are shown in millimeters (inches)
2.05 (.080) 1.95 (.077) PIN NUMBER 1 4.10 (.161) 3.90 (.154) B B A
1.60 (.063) 1.50 (.059) 1.85 (.072) 1.65 (.065) 0.35 (.013) 0.25 (.010)
12.30 11.70 (.484) (.461)
5.55 (.218) 5.45 (.215) 3.50 (.137) 3.30 (.130)
A
FEED DIRECTION
5.40 (.212) 5.20 (.205)
8.10 (.318) 7.90 (.312)
1.60 (.063) 1.50 (.059) TYP.
1.50 (.059) 1.30 (.052)
SECTION A-A
SECTION B-B
NOTES: 1. CONFORMS TO EIA-481-1. 2. CONTROLLING DIMENSION: MILLIMETER.
18.4 (.724) MAX. NOTE 3
13.2 (.52) 12.8 (.50) 330.0 (13.20) MAX. 50.0 (1.97) MIN.
NOTES: 1. CONFORMS TO EIA-481-1. 2. CONTROLLING DIMENSION: MILLIMETER. 3. INCLUDES FLANGE DISTORTION AT OUTER EDGE. 4. DIMENSION MEASURED AT INNER HUB.
14.4 (.57) 12.4 (.49) NOTE 4
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MTSF3N02HD
PACKAGE DIMENSIONS
Micro8 CASE 846A-02 ISSUE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 SOURCE SOURCE SOURCE GATE DRAIN DRAIN DRAIN DRAIN INCHES MIN MAX 0.114 0.122 0.114 0.122 --0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028
-A-
K
-B-
PIN 1 ID
G D 8 PL 0.08 (0.003)
M
TB
S
A
S
-T-
SEATING PLANE
0.038 (0.0015) H
C J L
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
Micro8 is a trademark of International Rectifier. Thermal Clad is a registered trademark of the Bergquist Company.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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MTSF3N02HD/D

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